Application characteristics：

This equipment is suitable for the production of 156-210mm silicon wafers, without the problem of lamination of traditional technology and the uniformity of square resistance. Higher uniformity of square resistance brings customers a narrower efficiency distribution and higher electrical performance Yield. The higher square resistance uniformity provides the possibility for the next generation of high square resistance process, which can help customers further improve product efficiency and competitiveness. This equipment uses gaseous boron source, which has the characteristics of low energy consumption and low maintenance requirements, and the operating cost is 1/3 of traditional technology. This equipment has the highest production capacity in the industry and can help customers reduce fixed asset investment and operating costs.

1. Put the film horizontally, high utilization of tube space, with low energy consumption and the highest production capacity in the industry

2. The direction of the silicon wafer is consistent with the direction of the airflow, the silicon wafer has a small obstruction to the airflow, and the uniformity between the chip and the chip is better;

3. Self-weight extrusion, reduce the gap between silicon wafers, controllable winding diffussion/winding plating;

4. Horizontal placement of wafers is more suitable for the production of super-large and ultra-thin silicon wafers;

5. The battery technology has high applicability and versatility, and can be used in various battery structures such as PERC and TOPCon;

6. The modular design of the whole machine has good compatibility and can be upgraded and converted with each other;