Annealing system Pindola ™ series PAX300 furnace for silicon-based semiconductor devices
Annealing system Pindola ™ series PAX300 furnace for silicon-based semiconductor devices
You can consult through the following phone or email
Sales E-mail:sales@laplace-tech.cn
Contact Number:0755-28329695 (曲先生)
  • Product Description
  • Data and Pictures


1. Maximum sample size: 2--6 inches, multiple pieces;

    Maximum temperature: 1200 degrees;

    Working gas: multi-channel gas (optional), can pass oxygen, nitrogen and inert gas 


 2. Application areas:

    Rapid thermal heating process (thermal annealing); 

    thin gate oxidation (nano device); 

    silicide structure; 

    silicide boundary point structure, etc.


Related Recommend

Laplace Reduced Pressure Horizontal Phosphorus Diffusion System  LRP370/05
Laplace Reduced Pressure Horizontal Phosphorus Dif...
Laplace Reduced Pressure Horizontal Boron Diffusion System  LRP370/05
Laplace Reduced Pressure Horizontal Boron Diffusio...
Laplace Reduced Pressure Horizontal Oxidation/Annealing System LOX370/05
Laplace Reduced Pressure Horizontal Oxidation/Anne...
Laplace Low Pressure Horizontal Chemical Vapor Deposition System  LPCVD LLP370/05
Laplace Low Pressure Horizontal Chemical Vapor Dep...