Annealing system Pindola ™ series PAX300 furnace for silicon-based semiconductor devices
Annealing system Pindola ™ series PAX300 furnace for silicon-based semiconductor devices
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  • Product Description
  • Data and Pictures


1. Maximum sample size: 2--6 inches, multiple pieces;

    Maximum temperature: 1200 degrees;

    Working gas: multi-channel gas (optional), can pass oxygen, nitrogen and inert gas 


 2. Application areas:

    Rapid thermal heating process (thermal annealing); 

    thin gate oxidation (nano device); 

    silicide structure; 

    silicide boundary point structure, etc.


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